CAPABILITIES FLEX RIGID-FLEX
Max. Layer Count 12 ≥ 16
Min. Core Thickness .001 in. .002 in.
Min. Starting Cu Foil Thickness O.L. 9 micron 9 micron
Max. Finished Cu Weight I.L. 2 oz. 2 oz.
Smallest Mech. Drill Diameter .0079 in. .0059 in.
Smallest Laser Drill Diameter .003 in. .003 in.
Max. Through Hole Aspect Ratio 14:1 14:1
Max. Blind Via Aspect Ratio .75:1 .75:1
Min. Blind Via Finished Hole Size .004 in. .004 in.
Min. Buried Via Finished .004 in. .004 in.
Min. Drill-to-Copper Clearance .010 in. .080 in.
Min. Trace/Space ≤.0035 in. ≤.0030 in.
Min. Pad Size for Test .005 in. .005 in.
Process Pad Diameter D + .014 in. (1-mil annular ring) D + .014 in. (1 mil annular ring)
Stacked Vias Yes Yes
Min. Wire-Bond Pad Size ≥.006 in. ≥.006 in.
Controlled Impedance Tolerance 10% 10%
Solder-Mask Registration Within .002 in. Within .002 in.
Solder-Mask Feature Tolerance .001 in. .001 in.
Solder-Mask Min. Dam Size .004 in. .002 in.
Min. Diameter Rout Cutter .024 in. .024 in.
Mechanical Routed Part Size Tolerance .010 in. .010 in.
Laser Hole Location Tolerance .0005 in. .0005 in.
Laser Routed Part Size Tolerance (achieved with
panels <.032 in. thick)
.001 in. .001 in.
Bow and Twist Tolerance N/A 7% along rigid area
Thickness Tolerance 10% 10%
Sequential Laminations 2 2
Conductive Filled Vias Yes Yes
Nonconductive Filled Vias Yes Yes