• Unmanned aerial equipment

    Production Type: Double sides RA copper with glue

    Material: Doulbe sides RA copper with glue18/25,Double sides black matte Coverlay 27.5UM

    Surface finish: ENIG 2U”

    Finished thickness: Board thickness0.15mm ,Gold Finger+PI Stiffener total thickness 0.3mm

  • B-ultrasound scanner

    Production Type: Three layers hollow board

    Material: Inner copper foil 35um,Outer Single side 18/25RA copper with glue,Yellow Coverlay 27.5UM

    Surface finish: Tin Plating40um

    Finished thickness: Board thickness0.25mm

  • Industrial equipment

    Production Type: 4 layers board with blind hole

    Material: Inner double sides ED copper with no glue 12/25,Outer single sides ED copper with no glue 12/12.5,Double sides Yellow Coverlay 27.5UM

    Surface finish: ENIG

    Finished thickness: Board thickness 0.22mm ,FR4+ board0.42mm

  • Industrial equipment

    Production Type: 4 layers board with blind and buried hole

    Material: Inner double sides ED copper with no glue 12/25,Outer single sides ED copper with no glue 12/12.5,Double sidesYellow Coverlay 27.5UM

    Surface finish: ENIG

    Finished thickness: Board thickness0.18mm ,FR4+ board total thickness1.18mm

  • Four layers Flex-Rigid PCB(Via Hole Board)

    Specification Size: 90*105mm

    Board Structure: L1(PCB)+L2-L3(FPC)+L4(PCB)

    CU Thickness: 18um

    Board Thickness: PCB=1.55mm±0.1mm/ FPC=0.1mm±0.03mm

    Aperture Size:Via hole 0.5mm

    Surface Finishing:ENIG 2μ”

    Solder Mask:Green solder mask, White silk screen

    Application Field:Robot

  • “Six layers Flex-Rigid PCB (Blind Hole)”

    Specification Size: 34*115mm

    Board Structure: L1+L2(PCB)+L3-L4(FPC)+L5-L6(PCB)

    CU Thickness: 18um

    Board Thickness: T=0.75mm±0.1mm/FPC=0.18mm±0.03mm

    Aperture Size:via hole 0.2mm,Blind hole 0.1mm

    Surface Finishing:ENIG 3μ”

    Solder Mask:Black solder mask,White silk screen

    Application Field:Projector